pcb layout guidelines


1. for prototype Whenever possible avoid using bread-board or vari-board with RF modules The long tracks inside these types of prototyping board introduce large capacitances /inductances to the circuit which can badly distort / detune rf signals. Ideally prototype or evaluation pcbs should be used.

2. Tracks connected to the antenna (RF input / output) pin of transmitter and receiver modules should be as short as possible. Any conductor connected to this track will act as an antenna, so it will lengthen and detune the actual antenna.

3. Design PCBs with an adequate ground plane. A ground plane is an area of conductive PCB connected to the circuits ground. It helps with RF propogation and is generally better when placed perpendicular to the antenna. It should be placed on the pcb in a large area, however it should not be placed directly underneath the RF module.

4. Use decoupling capacitors on the power supply circuitry to prevents rf interference passing through the power lines. Low power modules work on high frequencies eg. 433MHz so the capacitors should be of small value eg 10nF to cut out high frequency interference.

5. Use smoothing capacitors and a regulator to ensure a stable constant supply.

PCB Layout lecture notes

what is the difference between high speed pcb layout and normal pcb layout.

In high speed board design, the emphasis would be on placing components near enough together to minimize timing delays while still avoiding signal crosstalk.

PCB design means physical realization of the board, laying components, routing tracks, preparing manufacturing files. This part of design process should be done according some rules (i.e. high speed signals requirements – PCI-E, SATA, LVDS etc, length matching requirements – PCI, PATA)

High Speed Board design it is whole design process, starting from component selection, appropriate schematic and high speed PCB design (track impedance matching, controlled track length

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