3D System-on-Chip technologies for More than Moore systems


FREE-DOWNLOAD P Ramm, A Klumpp, J Weber… – Microsystem Technologies, 2010
Abstract 3D integration is a key solution to the predicted performance problems of future ICs
as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore
products. Through silicon via (TSV) technologies enable high interconnect performance







3D System-on-Chip technologies for More than Moore systems IEEE PAPER

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