dense capacitive and optical communication


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Aligning chips face-to-face for dense capacitive and optical communication

FREE-DOWNLOAD [PDF] JE Cunningham, AV Krishnamoorthy… – Advanced …, 2010
Abstract—We report a new method that precisely self-aligns face-to-face semiconductor chips
or wafers to enable commu- nication between the chips using electromagnetic waves. Our alignment
mechanism takes advantage of miniaturized versions of two of nature’s idealized shapes: 




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