Chip Scale IMU Using Folded-MEMS Approach


FREE-DOWNLOAD SA Zotov, MC Rivers, AA Trusov… – research Sensors, 2010
Abstract—This paper reports a new approach to design and fabrication of chip-level inertial measurement
units (IMUs). The folded-chip method utilizes a 3-D foldable silicon-on- insulator (SOI) backbone
suitable for high-aspect ratio sensor fabrication. Assembly is done on the wafer level 



IEEE PROJECTS

 



FREE IEEE PAPER