themal IC Analysis
What tools do integrated circuit manufacturers use to diagnose thermal hotspot risks in IC’s, both at the design level and post-fabrication? Are there tools like Mentor’s AutoTherm for PCB that are in use for semiconductor chip level simulations?
Re: Themal IC Analysis
both simulation and testing methods are used for thermal and thermal mechanical related failure evaluation.
Ansys is a good simulation tool.
Jeff Suhling’s group in Auburn University has developed a test chip which can be used to measure thermal stress in certain packaging format.
Interconnect, metal traced, and silicon itself are all subjected to failure if design or packaging process is not appropriate.