VLSI interconnect lines
Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
FREE-DOWNLOAD S Rzepka, K Banerjee Technology, Part A, research , 1998
BEING the major limit for further performance increase, interconnect lines
of integrated circuits have become the targets of massive technological improvements. The line
dimensions have been downscaled aggressively (eg, line width by factor 10, from 2 m to .
FREE IEEE PAPER