CMOS MEMS PRESENT AND FUTURE

CMOS MEMS PRESENT AND FUTURE



The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, preCMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for detection of organic volatiles in air and a 10-cantilever force sensor array for application in scanning probe microscopy. The paper finishes with a look into the future, discussing key challenges and future application fields for CMOS MEMS. Over the last decades, CMOS (complementary metal oxide semiconductor) technology has become by far the predominant fabrication technology for integrated circuits (IC). Tremendous efforts have been made to continuously improve process yield and reliability, while minimal feature sizes and fabrication cost continue to decrease. Semiconductor roadmaps show the current state and, more important, outline the future performance of CMOS technology with ever increasing integration density and decreasing feature sizes. Nowadays, the power of CMOS technology is not only exploited for ICs but also for a variety of microsensors and microelectromechanical systems (MEMS) benefiting from well established fabrication technologies and the availability of on-chip circuitry . In recent devices, unique selling points , such as calibration by digital programming, self-testing, and digital interfaces, have been implemented on-chip, demonstrating the strength of CMOS-based MEMS. The paper reviews the state-of-the-art in the field of CMOS MEMS and summarizes the main technology approaches described in the literature. As examples for the post-CMOS approach, two CMOS-based microsystems developed at the Physical Electronics Laboratory of ETH Zurich, Switzerland are presented, (i) a mass-sensitive chemical sensor for detection of volatile organics in air, and (ii) a force sensor array for application in scanning probe microscopy. Finally, the authors take a look into the future, discussing key challenges and future application fields for CMOS MEMS and NEMS (nano electromechanical systems).Click here for free

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