A RESEARCH ON MULTI-OBJECTIVE OPTIMIZATION OF THE GRINDING PROCESS USING SEGMENTED GRINDING WHEEL BY TAGUCHI-DEAR METHOD



Do Duc Trung, Nhu-Tung Nguyen, Dung Hoang Tien, Ha Le Dang

In this study, the mutil-objective optimization was applied for the surface grinding process of SAE420 steel. The aluminum oxide grinding wheels that were grooved by 15 grooves, 18 grooves, and 20 grooves were used in the experimental process. The Taguchi method was applied to design the experimental matrix. Four input parameters that were chosen for each experiment were the number of grooves in cylinder surface of grinding wheel, workpiece velocity, feed rate, and cutting depth. Four output parameters that were measured for each experimental were the machining surface roughness, the system vibrations in the three directions (X, Y, Z). The DEAR technique was applied to determine the values of the input parameters to obtaine the minimum values of machining surface roughness and vibrations in three directions. By using this technique, the optimum values of grinding wheel groove number, workpiece velocity, feed-rate, cutting depth were 18 grooves, 15 m/min, 2 mm/stroke, and 0.005 mm, respectively. The verified experimental was performed by using the optimum values of input parameters. The validation results of surface roughness and vibrations in X, Y, Z directions were 0.826 (µm), 0.531 (µm), 0.549 (µm), and 0. 646 (µm), respectively. These results were great improved in comparing to the normal experimental results. Taguchi method and DEAR technique can be applied to improve the quality of grinding surface and reduce the vibrations of the technology system to restrain the increasing of the cutting forces in the grinding process. Finally, the research direction was also proposed in this study

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How to cite paper:

Trung, D. , Nguyen, N. , Tien, D. , Dang, H. (2021). A RESEARCH ON MULTI-OBJECTIVE OPTIMIZATION OF THE GRINDING PROCESS USING SEGMENTED GRINDING WHEEL BY TAGUCHI-DEAR METHOD. EUREKA: Physics and Engineering, 1, 67-77. doi:https://doi.org/