different types of ic packaging


COMPUTER COURSE ONLINE

IC are packaged in many types they are: * BGA1
* BGA2
* Ball grid array
* CPGA
* Ceramic ball grid array
* Cerquad
* DIP-8
* Die attachment
* Dual Flat No Lead
* Dual in-line package
* Flat pack
* Flip chip
* Flip-chip pin grid array
* HVQFN
* LQFP
* Land grid array
* Leadless chip carrier
* Low insertion force
* Micro FCBGA
* Micro Leadframe Package
* MicroLeadFrame
* Mini-Cartridge
* Multi-Chip Module
* OPGA
* PQFP
* Package on package
* Pin grid array
* Plastic leaded chip carrier
* QFN
* QFP
* Quadruple in-line package
* ROM cartridge
* Shrink Small-Outline Package
* Single in-line package
* Small-Outline Integrated Circuit
* Staggered Pin Grid Array
* Surface-mount technology
* TO220
* TO3
* TO92
* TQFP
* TSSOP
* Thin small-outline package
* Through-hole technology
* UICC
* Zig-zag in-line package




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