Metal Wafer Bonding for MEMS Devices
FREE-DOWNLOAD V DRAGOI, E CAKMAK… – SCIENCE AND TECHNOLOGY, 2010 –
Abstract. Metal films can be used as bonding layers at wafer-level in MEMS manufacturing processes
for device assembly as well as just for elec- trical integration of different components. One has
to distinguish between two categories of processes: metal thermo-compression bonding