photonics research papers-41





Conjugated Organosilicon Materials for Organic Electronics and Photonics
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S Ponomarenko ,Silicon Polymers, 2011 ,Springer
In this chapter different types of conjugated organosilicon materials possessing luminescent
and/or semiconducting properties will be described. Such macromolecules have various
topologies and molecular structures: linear, branched and hyperbranched oligomers, 

Laser beam characterization using agile digital-analog photonics
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M Sheikh, PJ Marraccini ,Proc. SPIE, 2010 ,creol.ucf.edu
ABSTRACT Precise knowledge of laser beam parameters is a key requirement in many
photonics applications including for lasers and optics used in the transportation industry.
This paper reports on a novel motion-free laser beam characterization system using 

Fibre-array optical interconnection for silicon photonics
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 H Schröder, L Zimmermann ,Proc. of ECOC, , 2008  photonics.intec.ugent.be
Introduction Silicon photonics is a rapidly advancing field with a strong potential for applications
in integrated photonics. These applications comprise a wide spectrum ranging from optical sensors
to optical datatelecom sub-modules. The most outstanding merit of Silicon photonics is 

PHOTON PBL: Problem-Based Learning in photonics technology education
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N Massa, R Audet, J Donnelly, F Hanes , in Optics and Photonics , 2007 ,spie.org
Abstract: Problem-based learning (PBL) is an educational approach whereby students learn
course content by actively and collaboratively solving real-world problems presented in a
context similar to that in which the learning is to be applied. Research shows that PBL 

Problem-based learning in photonics technology education
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NM Massa, M Dischino, JF Donnelly , Optics and Photonics, 2008 ,144.206.159.178
ABSTRACT Problem-based learning (PBL) is an instructional approach in which students
learn by actively and collaboratively solving authentic problems encountered in real-world
situations. Research demonstrates that PBL improves students’ learning and retention, 

40-Gbps monolithically integrated transceivers in CMOS photonics
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T Pinguet, B Analui, G Masini ,Proc. Soc. Photo-Opt , 2008 ,144.206.159.178
ABSTRACT We report on the development of single-chip, monolithically-integrated 40 Gbps
transceivers built in a 130 nm SOI CMOS process as part of Phase II of the DARPA EPIC
program. In this talk we give an overview of the system architecture, including the transmit 

Photonics and web engineering in Poland, WILGA 2009
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RS Romaniuk ,Proceedings of SPIE, 2009 ,144.206.159.178
ABSTRACT The paper is a digest of work presented during a cyclic Ph. D. student
symposium on Photonics and Web Engineering WILGA 2009. Symposium is organized by
ISE PW in cooperation with professional organizations IEEE, SPIE, PSP and KEiT PAN. 

Advanced-laser processing of photonic and microelectronic components at Photonics Research Ontario
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PR Herman, G Goodno, X Gu, JB Kalbfleisch ,SPIE, 1999 ,ecf.utoronto.ca
ABSTRACT Photonics Research Ontario (PRO) is an Ontario Provincial Center of
Excellence supporting a broad range of laserprocessing activities within its photonics
program. These activities are centered at the University of Toronto, and split between an 

Microwave Photonics—From Concepts to Devices and Applications
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D Jager ,OPTICAL SCIENCE AND ENGINEERING, 2007 ,opt.zju.edu.cn
Within the last decade, the field of optic-microwave interactions has attracted growing
interest worldwide. The specific term of microwave photonics was first introduced in 1991
and used to describe novel optoelectronic components based on the interaction of 

Integrating 3D photonics and microfluidic using ultrashort laser pulses
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Y Cheng, K Sugioka, K Midorikawa ,SPIE Newsroom, 2006 ,spie.org
The integration of photonics and microfluidics can beneft both information technology and
sensor technology. On the one hand, optical devices that incorporate liquid elements can be
modified by changing or modifying the fluid, which could eventually revolutionize the 

Laser micromachining of semiconductors for photonics applications
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M Nantel, Y Yashkir, SK Lee, C Mugford ,Proceedings of , 2001 ,yashkir.com
ABSTRACT For decades, precisely machining silicon has been critical for the success of the
semiconductor industry. This has traditionally been done through wet chemical etching, but
in the pursuit of integrating photonics devices on a single chip, other techniques are worth 

Modeling of III-Nitride Quantum Wells with Arbitrary Crystallographic Orientation for Nitride-BasedPhotonics
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MV Kisin, RGW Brown ,COMSOL Conference 2008, 2008 ,ostendo.com
Abstract: A program for self-consistent modeling of electron-hole energy spectrum and
space-charge distribution in III-nitride based quantum well (QW) structures has been
developed. The program assumes arbitrary crystallographic orientation of the 

Electronics and photonics for high-energy physics experiments
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KT Pozniak ,Proc. SPIE, 2003 ,ise.pw.edu.pl
ABSTRACT The paper presents a debate over objective conditions connected with high
energy physics (hep) experiments. Some consequences stem from these conditions
concerning requirements for electronic apparatus and its structure. Systematic 

Materials and devices for compact optical amplification in Si photonics
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JH Shin, MS Yang, JS Chang, SY Lee, K Suh ,Proc. SPIE, 2008 ,144.206.159.178
ABSTRACT Materials and devices. for compact optical amplification in Si photonics is
reviewed. In particular, as the requirement for high gain per length together with high
refractive index renders traditional oxide-based approach problematic, Er-doping of 

Polymers for Electronics and Photonics
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EW Meijer, S Nijhuis ,Integration of Fundamental , 1989 ,alexandria.tue.nl
ABSTRACT Recently, polymers show promising prospects as active constituents of optical
and electronic devices, especially polymers for nonlinear optics and conducting polymers. In
a remote future even organic ferromagnets and molecular electronics may become more 

Intel unveils silicon photonics breakthrough: High-speed silicon modulation
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M Paniccia, V Krutul, S Koehl ,Technology, 2004 ,onversity.net
DISCLAIMER: THE MATERIALS ARE PROVIDED” AS IS” WITHOUT ANY EXPRESS OR
IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY,
NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY 



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